TIF500-30-11US-AS Great Thermal Conductivity Thermal Pad For Computer CPU/GPU Cooling

Great Thermal Conductivity Thermal Pad For Computer CPU/GPU Cooling

Product descriptions

TlF^®500-30-11U-AS series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Features

> Good thermal conductivity: 3.0 W/mK
> Naturally tacky needing no further
> adhesive coating
> Soft and Compressible for low stress
> applications
> Available in varies thickness

Application

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components

> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers

Standard Thicknesses

0.020-inch to 0.200-inch (0.5mm to 5.0mm)

Product Sizes:

8" x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

Vietnam Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.