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บ้าน > ผลิตภัณฑ์ > แผ่นความร้อน > Thermal Conductive Silicone Pad Aluminum Battery 5G Phone TIF500-65-11US Thermal Interface Material Thermal Conductive Gap Filler

Thermal Conductive Silicone Pad Aluminum Battery 5G Phone TIF500-65-11US Thermal Interface Material Thermal Conductive Gap Filler

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Place of Origin: Vietnam

ชื่อแบรนด์: Ziitek

ได้รับการรับรอง: RoHS

Model Number: TIF500-65-11US

เงื่อนไขการชําระเงินและการจัดส่ง

Minimum Order Quantity: 1000pcs

ราคา: 0.1-10 USD/PCS

Packaging Details: 24*13*12cm cartons

Delivery Time: 3-5 work days

Payment Terms: T/T

Supply Ability: 100000pcs/day

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Products name:
Thermal Conductive Silicone Pad Aluminum Battery 5G Phone Thermal Interface Material Thermal Conductive Gap Filler
Keywords:
Thermal Conductive Gap Filler
Hardness:
20 Shore 00
Thermal conductivity:
6.5W/mK
Sample:
Sample free
Density:
3.45g/cc
Flame rating:
94-V0
Materials:
Ceramic filled silicone elastomer
Color:
Gray
Application:
CPU,Aluminum Battery, 5G Phone
Products name:
Thermal Conductive Silicone Pad Aluminum Battery 5G Phone Thermal Interface Material Thermal Conductive Gap Filler
Keywords:
Thermal Conductive Gap Filler
Hardness:
20 Shore 00
Thermal conductivity:
6.5W/mK
Sample:
Sample free
Density:
3.45g/cc
Flame rating:
94-V0
Materials:
Ceramic filled silicone elastomer
Color:
Gray
Application:
CPU,Aluminum Battery, 5G Phone
Thermal Conductive Silicone Pad Aluminum Battery 5G Phone TIF500-65-11US Thermal Interface Material Thermal Conductive Gap Filler

Thermal Conductive Silicone Pad Aluminum Battery 5G Phone TIF500-65-11US Thermal Interface Material Thermal Conductive Gap Filler

 

Product descriptions

 

TIFTM500-65-11US series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

 

Features

> Good thermal conductive: 6.5W/m-K
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available

 

Application

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board

Typical Properties of TIF500-65-11US Series
Property Value Test method
Color Gray Visual
Construction &Compostion Ceramic filled silicone elastomer *****
Specific Gravity 3.45g/cc ASTM D792
Thickness range 0.020"(0.50mm)~0.200"(5.0mm) ASTM D374
Hardness 20 Shore 00 ASTM 2240
Continuos Use Temp -45 to 200℃ *****
Dielectric Breakdown Voltage >6000 VAC ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity 1.0X10¹² Ohm-meter ASTM D257
Flame rating 94 V0 UL E331100
Thermal conductivity 6.5W/m-K ASTM D5470

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

 

Standard Thicknesses

0.020-inch to 0.200-inch (0.5mm to 5.0mm)

 

Product Sizes:

8" x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

Thermal Conductive Silicone Pad Aluminum Battery 5G Phone TIF500-65-11US Thermal Interface Material Thermal Conductive Gap Filler 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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